Staff Manufacturing Engineer, PCB, Advanced Manufacturing Engineering

Minimum qualifications:

• Bachelors degree in Manufacturing, Mechanical, Electrical Engineering or equivalent practical experience.
• 10 years of experience in electroless and electrolytic copper plating.
• 10 years of experience in the sequential lamination process including microvia formation, laser/mechanical drilling, and laser energy.
• 10 years of experience with PCB copper, glass and dielectrics beyond standard FR-4, including high-speed/low-loss materials (e.g., Rogers, Megtron, Tachyon), high-Tg resins, and polyamides.
• 10 years of experience in interconnect PCB (multi-lam and LFF HDI) design and manufacturing processes development.

Preferred qualifications:

• Masters degree or PhD in Electrical, Mechanical, Industrial, Materials, or a related engineering field.
• 12 years of experience in Manufacturing, Quality, or Product Engineering for hardware technology and systems.
• Experience in technical leadership, project management, and executive communication.

About the jobBe part of a team that pushes boundaries, developing custom silicon solutions that power the future of Googles direct-to-consumer products. Youll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.

As an Advanced Staff Manufacturing Engineer for the New Technology Introduction process, you are an integral part of the Cloud Supply Chain Operations team. You will join the team that is responsible for releasing Googles hardware to mass production and developing a supply chain to deliver it. The core responsibility begins with leading the development and scale of new Printed Circuit Board (PCB) manufacturing and materials technologies to enable the growing roadmap of Google Cloud data center products. You will be the technical expert for advanced PCB manufacturing processes and provide technical leadership for the delivery of approaches and processes for our product development efforts.

In this role, you will work cross-functionally to influence technology direction and adoption for our data center products. You will also ensure that our supply chain stack is fully readied to execute novel manufacturing and test approaches in production environments.Behind everything our users see online is the architecture built by the Technical Infrastructure team to keep it running. From developing and maintaining our data centers to building the next generation of Google platforms, we make Googles product portfolio possible. Were proud to be our engineers engineers and love voiding warranties by taking things apart so we can rebuild them. We keep our networks up and running, ensuring our users have the best and fastest experience possible.

The US base salary range for this full-time position is $165,000-$245,000 + bonus + equity + benefits. Our salary ranges are determined by role, level, and location. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.

Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. Learn more about benefits at Google. Responsibilities

• Serve as the subject matter expert on PCB fabrication processes and laminate materials to deliver advanced PCB fabrication and design strategies. Influence product designs with stack-ups and Design for Manufacturability guidance and ensure the development and scale of novel, high-yield production processes.
• Lead the development of novel PCB manufacturing techniques to enable Googles product roadmap. Review layer stack-ups and PCB designs, match supplier technology/capability to product complexity, identify technology/capability gaps.
• Lead experimental validation for novel technologies, materials, and processes, through formal Designs of Experiments to systematically identify and establish scalable manufacturing processes for advanced PCB technologies.
• Work with Supplier Quality Engineering team to improve fabrication yield by leading root cause analysis on board defects like delamination or via opens, using failure analysis and statistical tools to implement supplier corrective actions.